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PC851X series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc851 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. telephone line interface/isolation 2. interface to power supply circuit 3. controller for ssrs, dc moters applications dip 4pin high collector-emitter voltage photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. high collector-emitter voltage (v ceo : 350v) 4. high isolation voltage between input and output (v iso(rms) : 5.0 kv) description PC851X series contains an ired optically coupled to a phototransistor. it is packaged in a 4-pin dip, available in smt gull- wing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 350v. 1 sheet no.: d2-a03401en date sep. 30. 2003 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. PC851X series
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a03401en outline dimensions product mass : approx. 0.21g (unit : mm) 1. through-hole [ex. PC851X ] 2. smt gullwing lead-form [ex. PC851Xi ] pc851 4.58 0.5 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 7.62 0.3 4.58 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. anode mark 0.5 0.1 : 0 to 13? epoxy resin 1 2 4 3 factory identification mark date code 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 1 2 pc851 0.35 0.25 factory identification mark date code PC851X series
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia philippines china * this factory making is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03401en PC851X series
sheet no.: d2-a03401en 4 model line-up please contact a local sharp sales representative to inquire about production status and lead-free options. PC851X series package model no. lead form PC851Xi sleeve smt gullwing PC851X through hole PC851Xp taping 100pcs/sleeve 2 000pcs/reel
sheet no.: d2-a03401en electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current transfer charac- teristics emitter-collector breakdown voltage collector current collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance cut-off frequency min. ? ? ? ? 6 2.0 ? 5 10 10 ? ? ? typ. 1.2 ? 30 ? ? ? 4.0 0.1 1 10 11 50 4 5 max. 1.4 10 250 1 ? ? ? 0.3 ? ? 10 12 unit v v a pf a v ma v ? khz s s symbol v f i r c t i ceo bv ceo bv eco i c v ce (sat) f c t r t f r iso response time rise time fall time input output i f = 20ma v r = 4v v = 0, f = 1khz v ce = 200v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 5ma, v ce = 5v dc500v, 40 to 60%rh v ce = 2v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? , ? 3db floating capacitance ? 0.6 1.0 pf c f v = 0, f = 1mhz i f = 20ma, i c = 1ma 350 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 50 1 70 reverse voltage v v r 6 350 6 50 150 200 ? 25 to + 100 ?55 to + 125 260 5.0 kv 5 PC851X series
sheet no.: d2-a03401en forward voltage v f (v) forward current i f (ma) 50?c 25?c 0?c 0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 5 10 20 50 100 200 500 1 ? 25?c t a = 75?c fig.6 forward current vs. forward voltage duty ratio 5 5 10 20 100 50 200 500 2 10 ? 3 10 ? 2 5210 ? 1 525 peak forward current i fm (ma) 1 10 000 5 000 2 000 1 000 pulse width 100 s t a = 25?c fig.5 peak forward current vs. duty ratio forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 25 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 25 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature 6 PC851X series diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 25 0 25 50 55 75 100 125 total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 25 0 25 50 75 100 125
sheet no.: d2-a03401en collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 1 2 3 4 5 2610 14 18 1ma 3ma 7ma 5ma 6 20 16 12 8 4 i c = 0.5ma t a = 25?c fig.12 collector-emitter saturation voltage vs. forward current 25 0507 5 100 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 200v ? 25 10 ? 11 10 ? 10 10 ? 9 10 ? 8 10 ? 7 10 ? 6 10 ? 5 fig.11 collector dark current vs. ambient temperature 100 0 50 150 025507 5 100 relative current transfer ratio (%) ambient temperature t a (?c) ? 25 i f = 5ma v ce = 5v fig.9 relative current transfer ratio vs. ambient temperature 0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 ? 25 0 25 50 75 100 ambient temperature t a (?c) collector-emitter saturation voltage v ce (sat) (v) i f = 20ma i c = 1ma fig.10 collector - emitter saturation voltage vs. ambient temperature 7 PC851X series fig.7 current transfer ratio vs. forward current fig.8 collector current vs. collector-emitter voltage 0 0 20 510 10 20ma 15ma 10ma 5ma 25ma collector current i c (ma) collector-emitter voltage v ce (v) p c (max.) t a = 25?c i f = 30ma v ce = 5v t a = 25?c 0 0.1 current transfer ratio ctr (%) 200 110 100 100 forward current i f (ma)
sheet no.: d2-a03401en frequency f (khz) 0 0.5 1 2 5 10 500 200 100 50 20 100 ? 1k ? voltage gain a v (db) ? 10 ? 20 v ce = 5v i c = 2ma t a = 25?c r l = 10k ? fig.15 frequency response v cc r l output r d please refer to the conditions in fig.15. v ce fig.16 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 PC851X series fig.14 test circuit for response time fig.13 response time vs. load resistance response time ( s) 0.2 0.1 0.5 1 2 5 10 100 0.01 0.1 1 10 50 200 500 v ce = 2v i c = 2ma t a = 25?c 20 50 t r t f t d t s load resistance r l (k ? ) v cc 90% 10% output input r l input output v ce r d t f t r t s t d please refer to the conditions in fig.13.
sheet no.: d2-a03401en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.2 2.54 1.7 8.2 (unit : mm) design guide PC851X series
sheet no.: d2-a03401en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) PC851X series
sheet no.: d2-a03401en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this device. regulation substances:cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. presence of odc 11 PC851X series
sheet no.: d2-a03401en package specification 12 12.0 6.7 5.8 10.8 520 2 sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) PC851X series
sheet no.: d2-a03401en 13 tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion PC851X series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 14 sheet no.: d2-a03401en important notices PC851X series

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